Details

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Further improvement of production efficiency, high-performance & flexible CMP system

• Dry-in/Dry-out
• Excellent process performance
• Reliable structure (one table-one head, dual module system)
• High operation rate/High throughput
• Suitable for multi-stage chemical cleaning
• Detection monitor at polishing endpoint (optional)
• In-line film thickness measuring device (optional)
• Diverse functions and flexible equipment configurations
• Module structure easy to modify and maintain
• Flexible transport mechanism

Features and Benefits

With a newly developed high-efficiency transport mechanism and WPH optimization algorithm, Ebara's highly reliable structures are maintained, such as one table-one head and a dual module system, enabling further productivity improvement. Adopting a flexible transport mechanism and further measures against cross-contamination contributes to improved yield. It also adopts a module structure that is easy to modify and upgrade, enabling installing new functions with less time in the future. In addition, power consumption is reduced by approximately 10% compared to the Model F-REX300X type, and the number of parts is also reduced, thereby achieving sustainability goals like reducing CO2 emissions in the supply chain. It supports more environmentally friendly semiconductor manufacturing.