Details

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Achieves both high-throughput, high-speed plating and superior uniformity performance

• High throughput capability
• Superior uniformity performance
• Suitable for plating on diverse substrates and thin seed layers
• Suitable for a variety of applications
• Flexible platform configuration

Features and Benefits

Model UFP600AS is a clean room-compatible electroplating system that forms finely detailed patterns for bump, rewiring, via, etc. and other applications on semiconductor wafers and panels. The Model UFP600AS uses our high-speed paddle system, which was cultivated with the semiconductor wafer system and abundant process experience, as a plating system for packaging panels. This achieves both high-speed plating and superior uniformity performance simultaneously. With flexible configurations that make it possible for a single unit to perform multiple processes, including bump, pillar, rewiring, through via hole, and fan-out, this model is being used for leading-edge panel-level packaging applications.